SI5915DC-T1-GE3【PDF 1/9 页】MOSFET 2P-CH 8V 3.4A 1206-8

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Sheet目录511

[1页]2页 3页 4页 5页

Si5915DC

Vishay Siliconix

Dual P-Channel 1.8 V (G-S) MOSFET

PRODUCT SUMMARY

FEATURES

V DS (V)

-8

R DS(on) ( Ω )

0.070 at V GS = - 4.5 V

0.108 at V GS = - 2.5 V

0.162 at V GS = - 1.8 V

I D (A)

- 4.6

- 3.7

- 3.0

? Halogen-free According to IEC 61249-2-21

Definition

? TrenchFET ? Power MOSFET

? Low Thermal Resistance

? 40 % Smaller Footprint than TSOP-6

? Compliant to RoHS Directive 2002/95/EC

APPLICATIONS

1206-8 ChipFET

? Load Switch or PA Switch for Portable Devices

S 1

S 2

D 1

G 1

Marking Code

D 1

D 2

S 2

G 2

DE XX

Lot Traceability

and Date Code

G 1

G 2

D 2

Part # Code

Bottom View

Ordering Information: Si5915DC-T1-E3 (Lead (Pb)-free)

Si5915DC-T1-GE3 (Lead (Pb)-free and Halogen-free)

D 1

P-C hannel MOSFET

D 2

P-C hannel MOSFET

ABSOLUTE MAXIMUM RATINGS T A = 25 °C, unless otherwise noted

Parameter

Drain-Source Voltage

Gate-Source Voltage

Symbol

V DS

V GS

-8

±8

Steady State

Unit

Continuous Drain Current (T J = 150 °C) a

Pulsed Drain Current

T A = 25 °C

T A = 85 °C

I D

I DM

- 4.6

- 3.3

- 10

- 3.4

- 2.5

Continuous Source Current (Diode Conduction) a

I S

- 1.8

- 0.9

Maximum Power Dissipation a

Operating Junction and Storage Temperature Range

Soldering Recommendations (Peak Temperature) b, c

T A = 25 °C

T A = 85 °C

P D

T J , T stg

2.1

1.1

- 55 to 150

260

1.1

0.6

°C

THERMAL RESISTANCE RATINGS

Parameter

Symbol

Typical

Maximum

Unit

Maximum Junction-to-Ambient a

Maximum Junction-to-Foot (Drain)

t ≤ 5s

Steady State

R thJA

R thJF

110

°C/W

Notes:

a. Surface mounted on 1" x 1" FR4 board.

b. See reliability manual for profile. The ChipFET is a leadless package. The end of the lead terminal is exposed copper (not plated) as a result

of the singulation process in manufacturing. A solder fillet at the exposed copper tip cannot be guaranteed and is not required to ensure ade-

quate bottom side solder interconnection.

c. Rework conditions: manual soldering with a soldering iron is not recommended for leadless components.

Document Number: 70693

S10-0936-Rev. C, 19-Apr-10

www.vishay.com

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